Sun Microsystems Computer Monitor SME5224AUPA 400 User Manual

SME5224AUPA-400

July 1999

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

DATASHEET

MODULE DESCRIPTION

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, (SME5224AUPA-400) delivers high performance

computing in a compact design. Based on the UltraSPARC™-II CPU, this module is designed using a small

form factor board with an integrated external cache. It connects to the high bandwidth Ultra™ Port Architec-

ture UPA bus via a high speed sturdy connector. The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, can

plug into any UPA connector, saving system design costs and reducing the production time for new systems.

Heatsinks are attached to components on the module board. The module board is encased in a plastic shroud.

The purpose of this shroud is to protect the components and channel airﬂow. Module design is geared

towards ease of upgrade and ﬁeld support.

Module Features

Module Beneﬁts

Ease of System Design

•

Small form factor board with integrated external cache

and UPA interface

•

JTAG boundary scan and performance instrumentation

PCB provides a multi-power plane bypass, reducing

systemboard design requirements

Performance

•

High performance UltraSPARC™ CPU at 400MHz

Four megabytes of external cache using high speed

•

Dedicated high bandwidth bus to processor

Glueless MP Support

Implements the high performance AUPA interface

Supports up to 16 Mbyte of external cache in a

four-way MP system

Simplify System Qualiﬁcations by

Complying with Industry and Government

Standards

•

Backwards compatibility with systems implementing a

UPA interface

Plastic shroud protects components and channels

airﬂow

•

Multi-layer PCB controls EMI radiation

Edge connectors and ejectors

Small form factor board encased in a heat resistant

shroud

•

On-board voltage regulator accepts 2.6 volts for the

Vdd_core; compatible with existing systems

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

DATA BUFFER DESCRIPTION

UltraSPARC-II Data Buffer (UDB-II)

The UltraSPARC™-II module has two UltraSPARC-II data buffers (UDB-II) - each a 256 pin BGA device - for

a UPA Interconnect system bus width of 128 Data + 16 ECC.

There is a bidirectional ﬂow of information between the external cache of the CPU and the 144-bit UPA inter-

connect. The information ﬂow is linked through the UDB-II, it includes: cache ﬁll requests, writeback data for

dirty displaced cache lines, copyback data for cache entries requested by the system, non-cacheable loads and

stores, and interrupt vectors going to and from the CPU.

Each UDB-II has a 64-bit interface plus eight parity bits on the CPU side, and a 64-bit interface plus eight error

correction code (ECC) bits on the system side.

The CPU side of the UDB-II is clocked with the same clock delivered to UltraSPARC-II (1/ 2 of the CPU pipe-

line frequency).

EXTERNAL CACHE DESCRIPTION

The external cache is connected to the E-cache data bus. Nine SRAM chips are used to implement the four

megabyte cache. One SRAM is used as the tag SRAM and eight are used as data SRAMs. The tag SRAM is

128K x 36, while the data SRAMs are 256K x 18. All nine SRAMs operate in synchronous register-latch mode.

The SRAM interface to the CPU runs at one-half of the frequency of the CPU pipeline. The SRAM signals

operate at 1.9V HSTL. The SRAM clock is a differential low-voltage HSTL input.^[1]

1. PECL (Positive Emitter Coupled Logic) clocks are converted on the module to the HSTL clocks, for the E-cache

interface.

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Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

MODULE COMPONENT OVERVIEW

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, (SME5224AUPA-400), (see Figure 1), consists of the

following components:

• UltraSPARC™-II CPU at 400 MHz

• UltraSPARC-II Data Buffer (UDB-II)

• 4.0 Megabyte E-cache, made up of eight (256K X 18) data SRAMs and one 128K X 36 Tag SRAM

• Clock Buffer: MC100LVE210

• DC-DC regulator (2.6V to 1.9V)

• Module Airﬂow Shroud

Block Diagram

The module block diagram for the UltraSPARC™–II, 400 MHz CPU, 4 Mbyte E-cache module

is illustrated in Figure 1.

Tag SRAM ADDR [17:0] + Control

UPA ADDR [35:0] + Control

UltraSPARC-II

Tag SRAM DATA [24:0]

CPU

SRAM ADDR [19:0] + Control

SRAM

256K x 18

SRAM

256K x 18

Tag SRAM

128K x 36

DATA [143:72]

UDB-II

DATA [71:0]

UDB-II

1.9V

DC-DC

Clock Buffer

Clocks

Regulator

UDB-II

Control

2.6V

UPA_DATA [143:0]

UPA Connector

Figure 1. Module Block Diagram

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

SYSTEM INTERFACE

Figure 2 shows the major components of a UPA based uniprocessor system. The system controller ^[1]for the

UPA bus arbitrates between the UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, and the I/ O bridge chip.

The ﬁgure also illustrates a slave-only UPA graphics port for Sun graphics boards

The module UPA system interface signals run at one-quarter of the rate of the internal CPU frequency.

UltraSPARC-II

Module

SME5224AUPA-400

UPA

Graphic

Device

UPA Address Bus 0

System

Controller

UPA Address Bus 1

UPA Data Bus

144

UPA Data Bus

I/O Bridge

Chip

Memory Data Bus

Memory

SIMMs

Cross Bar

Switch

Expansion Bus

Figure 2. Uniprocessor System Conﬁguration

UPA Connector Pins

The UPA edge connector provides impedance control. The pin assignments are shown with the physical mod-

ule connector and are represented on page 24 and page 25.

UPA Interconnect

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, (SME5224AUPA-400), supports full master and

slave functionality with a 128-bit data bus and a 16-bit error correction code (ECC).

All signals that interface with the system are compatible with LVTTL levels. The clock inputs at the module

connector, CPU_CLK, UPA_CLK0, and UPA_CLK1, are differential low-voltage PECL compatible.

1. Only two megabytes of external cache are recognized and supported when using the

Dual Processor System Controller (DSC, Marketing Part No.STP2202ABGA).

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UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

Module ID

Module IDs are used to conﬁgure the UPA address of a module. The UPA_PORT_ID[4:3] are hardwired on

the module to “0”. UPA_PORT_ID[1:0] are brought out to the connector pins. Each module is hardwired in

the system to a ﬁxed and unique UPA address. This feature supports systems with four or fewer processors.

For systems that need to support eight modules, UPA_SPEED[1] is connected to SYSID[2] in UDB-II to pro-

vide UPA_PORT_ID[2].

Systems which support more than eight modules must map the limited set of UPA_PORT_IDs from this mod-

ule to the range of required UPA_PORT_IDs, by implementation-speciﬁc means in the system.

System ﬁrmware (Open Boot Prom) uses UPA_CONFIG_REG[42:39] for generating correct clocks to the CPU

module and the UPA system ASICs. These bits are hardwired on the module and are known at MCAP[3:0] at

the UltraSPARC-II pins. The 4-bit MCAP value for this module is 0111b.

Module Power

Two types of power are required for this module: V_DDat 3.3V, and V_{DD_CORE}at 2.6V. The V_{DD_CORE}supplies the

DC-DC regulator which in turn supplies 1.9 volts to the core of the processor chip, the UDB-II external cache

interface I/ O, and the SRAM I/ O. A resistor located on the module sends the program value to the power

supply so it generates V_{DD_CORE}at 2.6V to the regulator.

JTAG Interface

The JTAG TCK signal is distributed to UDB-II, SRAMs and the CPU. For additional information about the

JTAG interface, see "JTAG Testability," on page 22, and "JTAG (IEEE 1149.1) Timing," on page 23.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

SIGNAL DESCRIPTION ^[1]

System Interface

Signal

Type

Name and Function

UPA_ADDR[35:0]

I/O

Packet switched transaction request bus. Maximum of three other masters and one

system controller can be connected to this bus. Includes 1-bit odd-parity protection.

Synchronous to UPA_CLK.

UPA_ADDR_VALID

UPA_REQ_IN[2:0]

I/O

Bidirectional radial UltraSPARC-II Bus signal between the UltraSPARC-II CPU and the

system. Driven by UltraSPARC-II to initiate UPA_ADDR transactions to the system.

Driven by system to initiate coherency, interrupt or slave transactions to

UltraSPARC-II CPU. Synchronous to UPA_CLK. Active high.

UltraSPARC-II system address bus arbitration request from up to three other

UltraSPARC-II bus ports, which may share the UPA_ADDR. Used by the

UltraSPARC-II for the distributed UPA_ADDR arbitration protocol. Connection to other

UltraSPARC-II bus ports is strictly dependent on the Master ID allocation.

Synchronous to UPA_CLK. Active high.

UPA_SC_REQ_IN

UPA_S_REPLY[4:0]

UltraSPARC-II system address bus arbitration request from the system. Used by the

UltraSPARC-II CPU for the distributed UPA_ADDR arbitration protocol.

Synchronous to UPA_CLK. Active high.

UltraSPARC-II system reply packet, driven by system controller to the UPA port.

Synchronous to UPA_CLK. Active high. UPA_S_REPLY [4] is a no-connect.

UPA_DATA_STALL

UPA_P_REPLY[4:0]

Driven by system controller to indicate whether there is a data stall. Active high.

UltraSPARC-II system reply packet, driven by the UltraSPARC-II to the system.

Synchronous to UPA_CLK. Active high.

UPA_DATA[127:0]

UPA_ECC[15:0]

UPA_ECC_VALID

I/O

UPA Interconnect data bus.

ECC bits for the data bus. 8-bit ECC per 64-bits of data.

Driven by the system controller to indicate that the ECC is valid for the data on the

UPA interconnect data bus: active high.

UPA_REQ_OUT

I/O

Arbitration request from this module: active high.

UPA_PORT_ID[1:0]

Module’s identiﬁcation signals: active high. UPA_SPEED[1] acts as a

UPA_PORT_ID[2]

Clock Interface

Signal

Type

Name and Function

UPA_CLK[1:0]_POS

UPA_CLK[1:0]_NEG

UPA Interconnect Clock: two copies are provided, one for the CPU and one for the

UDBs

CPU_CLK_POS

CPU_CLK_NEG

Differential Clock inputs to the clock buffer on the module

UPA_RATIO

This is not used.

UPA_SPEED [0]

UPA_SPEED [1]

UPA_SPEED [0] is an output tied low on the module

I/O

UPA_SPEED[1] is tied low with 510 ohms and high to 3.3V with 4.7k ohms. It is

also connected to the SYSID [2] on each UDB-II.

UPA_SPEED [2]

UPA_SPEED [2] is tied low on the module

1. For the modular connector pin assignments (UPA pin-out assignments) see page 24 and page 25.

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UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

JTAG/Debug Interface

Signal

Type

Name and Function

TDO

IEEE 1149 test data output. A three-state signal driven only when the TAP controller is

in the shift-DR state.

TDI

IEEE 1149 test data input. This pin is internally pulled to logic one when not driven.

TCK

IEEE 1149 test clock input. This pin if not hooked to a clock source must always be

driven to a logic 1 or a logic 0.

TMS

IEEE 1149 test mode select input. This pin is internally pulled to logic one when not

driven. Active high.

TRST_L

IEEE 1149 test reset input (active low). This pin is internally pulled to logic one when not

driven. Active low.

Initialization Interface

Signal

Type

Name and Function

UPA_RESET_L

Driven by the system controller for the POR (power-on) resets and the fatal system

reset. Asserted asynchronously. Deasserted synchronous to UPA_CLK. Active low.

UPA_XIR_L

Driven to signal externally initiated reset (XIR). Actually acts like a non-maskable

interrupt. Synchronous to UPA_CLK. Active low, asserted for one clock cycle.

Miscellaneous Signals

Signal

Type

Name and Function

TEMP_SENSE_NEG

TEMP_SENSE_POS

Connected to a thermistor^[1]adjacent to the CPU package.

POWER_SET_POS

POWER_SET_NEG

POWER_SET_NEG is tied to GND on the module. POWER_SET_POS is connected

to GND via a 1690-ohm resistor. Sets voltage of programmable supply.

POWER_OV

Connected to GND via a 1180-ohm resistor. Sets overvoltage level for programmable

supply.

1. The thermistor used on the module (SME5224AUPA-400) is manufactured by KOA. Operating at 47K the thermistor has KOA part

number NT32BT473J.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

UPA AND CPU CLOCKS

Module Clocks

The module receives three differential pair low voltage PECL (LVPECL) clock signals (CPU_CLK, UPA_CLK0

and UPA_CLK1) from the systemboard and terminates them. The CPU_CLK is unique in the system, but the

UPA_CLKs are two of many UPA clock inputs in the system.

The CPU_CLK operates at 1/ 2 the CPU core frequency. The UPA_CLKs operate at the UPA bus frequency.

The CPU to UPA clock ratios refer to the CPU core to UPA bus clock signal frequency. The CPU on the module

will automatically sense the clock ratio driven by the systemboard as long as the module clock timing is

satisﬁed.

The UltraSPARC-II CPU and UDB-II data buffers detect and support multiple CPU to UPA clock frequency

ratios. The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module is production tested in the 4:1 ratio (400 MHz

CPU and 100 MHz UPA). It can be qualiﬁed at other ratios in speciﬁc systemboards.

Tested CPU to UPA

UltraSPARC-II CPU Module

Frequency Ratio

Other supported CPU to UPA Frequency Ratios

400 MHz, 4 Mbyte E-cache

4:1

3:1, 5:1, 6:1

System Clocks

The systemboard generates and distributes the CPU and UPA LVPECL clocks. The systemboard includes a

frequency generator, frequency divider, clock buffers, and terminators.

The buffers fan-out the LVPECL clocks to the many UPA devices: the module, cross-bar data switches, system

controller, FFB, and the system I/ O bridge. The LVPECL clock trace pairs are routed source-to-destination.

Each net is terminated at the destination. Most destinations are to single devices. The PCB traces for the

LVPECL clocks are balanced to provide a high degree of synchronous UPA device operation.

System Clock Distribution

The goal of this clock distribution is to deliver a quality clock to each system UPA device simultaneously and

with the correct clock relationships to the module clocks. For a discussion on how to layout and balance the

systemboard LVPECL clock signals and UPA bus signals, see the UPA Electrical Bus Design Note (Document

Part Number: 805-0089).

The effective length of the CPU_CLK, UPA_CLK0, and UPA_CLK1 clocks signals on the module are provided

in the UPA AC Timing Speciﬁcation section of this data sheet.

The block diagram for the LVPECL clocks "Clock Signal Distribution," on page 10, illustrates a typical system

clock distribution network. Each clock line is a parallel-terminated, dual trace LVPECL clock signal for the

CPU, the UPA and the SRAM devices.

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UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

Module Boundary

CPU_CLK

UPA_CLK0

Module

Connector

SRAM

Serial

Parallel

UDB-II

Clock Buffer

UDB-II

Clock

Generator

Clock

Divider

SRAM/TAG

UltraSPARC-II

CPU

UPA_CLK1

UPA_CLK

Clock

Buffer

UPA_CLK2

UPA Device

UPA_CLKx

Figure 3. Clock Signal Distribution

LOW VOLTAGE PECL

Two trace signals compose each clock: one positive signal and one negative signal. Each signal is 180-degrees

out of phase with the other. Signal timing is referenced to when the positive LVPECL signal transitions from

low to high at the cross-over point, when the negative signal transitions from high to low. The trace-pair are

routed side-by-side and use parallel termination, (speciﬁc routing techniques are require).

CPU CLOCK INPUT

The PLL in the CPU doubles the clock frequency presented at its clock pin. So, for a 400 MHz core CPU clock

frequency, the CPU_CLK signal is 200 MHz. Therefore, for the CPU, actions will appear to occur at both tran-

sitions of the input CPU_CLK.

CLOCK TRACE DELAYS

The LVPECL propagation time is constant for all clock signals so all balancing is based on length rather than

time. All LVPECL traces are striplines (dielectric and power planes top and bottom) with a ﬁxed 180 ps per

inch propagation time using the FR4, PCB Dielectric.

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UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

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ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings^[1]

Symbol

V_DD

V_{DD_CORE}

V_I

Parameter

Rating

0 to 3.8

Units

Supply voltage range for I/O

Supply voltage range for CPU core

Input voltage range^[3]

[2]

0 to 3.0

-0.5 to V_DD+ 0.5

± 20

V_O

Output voltage range

I_IK

Input clamp current

°C

I_OK

Output clamp current

± 50

I_OL

Current into any output in the low state

Storage temperature (non-operating)

T_STG

-40 to 90

1. Operation of the device at values in excess of those listed above will result in degradation or destruction of the device. All voltages

are deﬁned with respect to ground. Functional operation of the device at these or any other conditions beyond those indicated under

“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may

affect device reliability.

2. The V_{DD_CORE}supplies voltage to the onboard DC-DC regulator. The onboard DC-DC regulator then powers the CPU core and the

SRAM I/O bus interface. The V_{DD_CORE}must be lower than V_DD, except when the CPU is being re-cycled, at which time the V_DDcan

be lower than V_{DD_CORE}for 30 ms or less, provided that the current is limited to twice thew maximum CPU rating.

3. Unless otherwise noted, all voltages are with respect to the V_SSground.

Recommended Operating Conditions

Symbol

V_DD

Parameter

Min

3.14

2.47

–

Typ

3.30

2.60

Max

3.46

2.73

–

Units

Supply voltage for I/O

V_{DD_CORE}

V_SS

V_IH

Supply voltage for the CPU core^[1]

Ground

High-level input voltage

Low-level input voltage

High-level output current

Low-level output current

Operating junction temperature

Operating ambient temperature

2.0

-0.3

–

V_DD+ 0.2

0.8

V_IL

–

I_OH

–

-4

°C

I_OL

–

T_J

–

[2]

T_A

–

1. A current of 2.6V supplies power to the DC-DC regulator which in turn supplies 1.9V to the CPU core.

2. Maximum ambient temperature is limited by airﬂow such that the maximum junction temperature does not exceed T_J. See the section

"Thermal Speciﬁcations," on page 18.

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400 MHz CPU, 4.0 MB E-Cache

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DC Characteristics^[1]

Symbol

Parameter

Conditions

Min

2.4

Typ

–

Max

Units

V_OH

V_IH

High-level output voltage

V_DD= Min, I_OH= Max

–

High-level input voltage, PECL clocks,

2.28

2.0

–

High-level input voltage,

except PECL clocks

–

V_IL

Low-level input voltage, PECL clocks

–

1.49

0.8

Low-level input voltage,

except PECL clocks

V_OL

Low-level output voltage

V_DD= Min, I_OL= Max

–

9.3

10.05

–

0.4

12.04

11.6

[2] [3]

I_DD

Supply current for V_DD

V_DD= Max, Freq.=Max

V_{DD_CORE}= Max, Freq.=Max

V_DD= Max, V_O= 0.4V to 2.4V

[4] [3]

I_{DD_CORE}

I_OZ

Supply current for V_{DD_CORE}

High-impedance output current

(Outputs without pull-ups)

µA

–

-30

High-impedance output current

(Outputs with pull-ups)

V_DD= Max, V_O= V_SSto V_DD

–

250

I_I

Input current (inputs without pull-ups)

Input current (inputs with pull-ups)

High level output current

V_DD= Max, V_I= V_SSto V_DD

–

± 20

-250

–

µA

I_OH

I_OL

Low level output current

–

1. Note that this tables speciﬁes the DC characteristics at the UPA 128M connector.

2. The supply current for the V_DDincludes the supply current for the CPU, UDB-II, and the SRAMs.

3. The typical DC current values represent the current drawn at nominal voltage with a typical, busy computing load. Variations in the

device, computing load, and system implementation affect the actual current. The maximum DC current values will rarely, if ever, be

exceeded running all known computing loads over the entire operating range. The maximum values are based on simulations.

4. The supply current for the V_{DD_CORE}includes the supply current for the CPU, UDB-II, SRAMs, via the DC to DC regulator.

Module Power Consumption

This UltraSPARC-II module requires two supply voltages. The required voltages (provided to the module) for

the V_DDand V_{DD_CORE}, are respectively 3.30V and 2.6V. The estimated maximum power consumption of the

UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module (SME5224AUPA-400) is 70 watts at 400 MHz.

The estimated maximum power consumption includes the CPU, the SRAMs, the clock logic and the 8 watts

consumed by the DC-DC regulator.

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400 MHz CPU, 4.0 MB E-Cache

Advanced Version

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UPA Data Bus SPICE Model

A typical circuit for the UPA data bus and ECC signals is illustrated in Figure 4:.

Edge Connector

UDB-II Driver

3.1 nH

Trace 1

Trace 2

1.0 pF 1.0 pF

Edge Connector

via 0.6 pF

3.1 nH

Trace 3

Trace 4

1.0 pF 1.0 pF

via 0.6 pF

7 pF

Measure point for XB1

XB1 BGA Package Loading

7 pF

Measure point for CPU

UDB-II of Second Module

Package Loading

Worst Case: Z₀= 60Ω, T_P= 180 ps/ inch, Trace 1 Length = 4.4”, Trace 2 Length = 0.6”, Trace 3 Length

= 1.2”, Trace 4 Length = 4.4”

Best Case: Z₀= 50Ω, T_P= 160 ps/ inch, Trace 1 Length = 2.2”, Trace 2 Length = 0.2”, Trace 3 Length

= 0.2”, Trace 4 Length = 2.2”

Figure 4. Module System Loading: Example for UPA_DATA, UPA_ECC

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UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

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UPA AC TIMING SPECIFICATIONS

The UPA AC Timing Speciﬁcations are referenced to the UPA connector. The timing assumes that the clocks

are correctly distributed, (see the section "System Clock Distribution," on page 9). The effective PCB clock

trace lengths (CPU_CLK, UPA_CLK0 and UPA_CLK1) are used to calculate a balanced clock system.

UPA_CLK Module Clocks

All the UPA_CLKx trace pairs are the same length coming from the clock buffer and going to each load. To

calculate UPA_CLK0 and UPA_CLK1 for the module, assume the trace lengths on the module are 9 inches,

(which includes the module connector).

CPU_CLK Module Clock

The CPU_CLK trace on the system board is typically only a few inches long. It is the length of the traces used

for the UPA_CLKs from the clock buffer plus the length of UPA_CLK from the clock divider to the clock

buffer minus the effective trace length of CPU_CLK on the module, 18 inches, including the module

connector.

Clock Buffers

The Clock buffer on the systemboard and the clock buffer on the module are assumed to have similar delays.

The clock buffers have a 600 ps delay.

Timing References

The setup, hold and clock to output timing speciﬁcations are referenced at the module connector for the sig-

nal and at the system UPA device pin. There is no reference point associated with the module since the

module trace lengths provided above are effective lengths only and may not represent actual traces.

The following table speciﬁes the AC timing parameters for the UPA bus. For waveform illustrations see the

illustration, "Timing Measurement Waveforms," on page 15.

Static signals consist of: UPA_PORT_ID[1:0], UPA_RATIO, and UPA_SPEED[2:0].

Setup and Hold Time Speciﬁcations

400 MHz CPU

100 MHz UPA

Symbol

t_SU

Setup time

Setup Signals and Hold Time Signals

UPA_DATA [127:0]

Waveforms

Min

3.4

2.9

Max

–

Unit

UPA_ADDR [35:0]

–

UPA_ADDR_VALID, UPA_REQ_IN [2:0],

UPA_SC_REQ_IN, UPA_DATA_STALL,

UPA_ECC_VALID, UPA_RESET_L, UPA_XIR_L

UPA_ECC [15:0]

3.4

–

UPA_S_REPLY [3:0]

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Setup and Hold Time Speciﬁcations

400 MHz CPU

100 MHz UPA

Symbol

t_H

Hold time

Setup Signals and Hold Time Signals

Waveforms

Min

0.4

Max

–

Unit

UPA_DATA [127:0]

UPA_ADDR [35:0]

–

UPA_ADDR_VALID, U P A _REQ_IN [2:0],

UPA_SC_REQ_IN, UPA_DATA_STALL,

UPA_ECC_VALID, UPA_RESET_L, UPA_XIR_L

UPA_ECC [15:0]

0.4

–

UPA_S_REPLY [3:0]

The following table, "Propagation Delay, Output Hold Time Speciﬁcations," speciﬁes the propagation delay

and output hold times for the UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module with a 4 Mbyte E-cache.

Propagation Delay, Output Hold Time Speciﬁcations

400 MHz CPU

100 MHz UPA

Symbol

t_P

Clock-to-Out Signals and Output-Hold Signals

Waveforms

Min

–

Max

3.8

Unit

UPA_DATA [127:0]

Clock-to-

Out

UPA_ADDR [35:0]

UPA_ADDR_VALID, UPA_P_REPLY[4:0],

UPA_REQ_OUT

–

3.1

UPA_ECC [15:0]

–

3.8

–

t_OH

UPA_DATA [127:0]

1.1

Output-

Hold

UPA_ADDR [35:0]

–

UPA_ADDR_VALID, UPA_P_REPLY[4:0]

UPA_ECC [15:0]

1.1

–

Timing Measurement Waveforms

xx_CLKx_NEG

xx_CLKx_POS

2.4V

1.6V

2.4V

0.4V

2.4V

0.4V

xx_CLKx_NEG

2.4V

xx_CLKx_POS

1.6V

2.4V

0.4V

2.4V

0.4V

t_p

t_SU

t_H

t_OH

2.0V

0.8V

Rising Edge

Output

2.0V

Data Input

0.8V

t_p

t_SU

t_H

t_OH

2.0V

Falling Edge

Output

0.8V

Waveforms 1

Waveforms 2

Figure 5. Timing Measurement Waveforms

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

MECHANICAL SPECIFICATIONS

The module components and dimensions are speciﬁed in Figure 6, Figure 7, Figure 8 and Figure 9.

Module Ejectors

CPU/Voltage Regulator Heat Sink

Thermistor Location (RT0201)

UDB Heat Sinks

Front SRAM Heat Sinks

Figure 6. CPU Module Components

6.250 [158.75]

5.890 [149.61]

0.315

[8.00]

0.179 [4.55]

3.680

[93.47]

4.250

[107.95]

Pin 328

0.570 [14.48]

0.174 [4.41]

Pin 1

0.535 [13.59]

0.540 [13.72]

0.112 [2.86 ]

.200 [5.08]

3.213 [81.61]

2.551 [64.79]

Dimensions: inches [millimeters]

Figure 7. CPU Module (Component Dimensions)

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

Module

Shroud

Bidirectional

Airflow

Bidirectional

Airflow

Backside SRAM

Heat sink

Figure 8. CPU Module Side View

Provide Minimum Frontside Clearance

0.079 [2.00]

1.318

[33.48]

Maximum

Maximum Card Guide Depth

0.087 [2.201]

0.062 + 0.008

[1.57 + 0.20]

0.298

[7.57] Maximum

Provide Minimum

0.079 [2.00] Backside Clearance

Dimensions: inches [millimeters]

Figure 9. CPU Module Side View Dimensions

NOTE: A minimum backside clearance is required for airﬂow cooling of the backside heatsink.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

THERMAL SPECIFICATIONS

The maximum CPU operating frequency and I/ O timing is reduced when the junction temperature (Tj) of the

CPU device is raised. Airﬂow must be directed to the CPU heatsink to keep the CPU device cool. Correct air-

ﬂow maintains the junction temperature within its operating range. The airﬂow directed to the CPU is usually

sufﬁcient to keep the surrounding devices on the topside of the module cool, including the SRAMs and clock

circuitry. The cooling of the backside SRAMs is less critical, but still requires airﬂow according to the speciﬁ-

cations found in the section "Airﬂow Bottomside," on page 20.

The CPU temperature speciﬁcation is provided in terms of its junction temperature. It is related to the case

temperature by the thermal resistance of the package and the power the CPU is dissipating.

The case temperature can be measured directly by a thermocouple probe, verifying that the CPU junction

temperature is correctly maintained over the entire operating range of the system. This includes both the

compute load and the environmental conditions for the system. If measuring the case temperature is prob-

lematic, then, measure the heatsink temperature and calculate the junction temperature. Both approaches for

calculating junction temperature are explained in this section. Irrespective of which method is used, accurate

measurement is required.

Two Step Approach to Thermal Design

Step One determines the ducted airﬂow requirements based on the CPU power dissipation, the thermal char-

acteristics of the CPU package, and the surrounding heatsink assembly.

See "Thermal Deﬁnitions and Speciﬁcations," on page 19 for the modules speciﬁcations. The speciﬁcations for

the heatsinks are found in the table "Heatsink-to-Air Thermal Resistance," page 20.

Step Two verifies the cooling effectiveness of the design, by measuring the heatsink or case temperature

and calculating the junction temperature. The junction temperature must not exceed the CPU specification.

In addition, the lower the junction temperature, the higher the system reliability. The CPU temperature

must be verified under a range of system compute loads and system environmental conditions, using one of

the temperature measuring methods described herein.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

Thermal Deﬁnitions and Speciﬁcations

Term

Deﬁnition

Speciﬁcation

Comments

Maximum device

junction

temperature

85 °C,

The Tj can't be measured directly by a thermo-couple

probe. It must always be estimated as Tj or less. Less is

preferred.

Maximum case

temperature

76.7 °C

Measurable at the top-center of the device. Requires a hole

in the base of the heatsink to allow the thermocouple to be

in contact with the case. Maximum case temperature is

speciﬁed using a CPU device at its maximum power

dissipation.

Heatsink

temperature

75 °C

Measurable at the temperature of the base of the heatsink.

The best approach is to embed a thermocouple in a cavity

drilled in the heatsink base. An alternative approach is to

place the thermocouple between the ﬁns/ pins of the heat-

sink (insulated from the airﬂow) and in contact with the

base plate of the heatsink.

Module ambient air see page 20 The air temperature as it approaches the heatsink.

temperature

Typical power

dissipation of the

CPU

19.0 W

The worst case compute loads over the entire process

range.

θjc

Maximum

0.5°C/ W

The speciﬁcation for the UltraSPARC™–II, 400 MHz CPU

in a ceramic LGA package.

junction-to-case

thermal resistance

of the package

θcs

θsa

Case-to-heatsink

thermal resistance

0.1 °C/ W

Accuracy of this value requires that good thermal contact is

made between the package and the heatsink.

Heatsink-to-air

thermal resistance

see page 20 This value is dependent on the heatsink design, the airﬂow

direction, and the airﬂow velocity.

Air velocity

see page 20 The ducted airﬂow.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

Temperature Estimating and Measuring Methods

The following methods can be used to estimate air cooling requirements and calculate junction temperature

based on thermo-couple temperature measurements.

Airﬂow Cooling Measurement Method

The relationship between air temperature and junction temperature is described in the following thermal

equation:

Tj = Ta + [Pd (θjc + θcs + θsa)]

Note: Testing is done with the worst-case power draw, software loading, and ambient air temperature.

Determination of the ambient air temperature (Ta) and the “free-stream” air velocity is required in order to

apply the airﬂow method. The table "Heatsink-to-Air Thermal Resistance," illustrates the thermal resistance

between the heatsink and air (θsa).

Note that the airﬂow velocity can be measured using a velocity meter. Alternatively it may be determined by

knowing the performance of the fan that is supplying the airﬂow. Calculating the airﬂow velocity is difﬁcult.

It is subject to the interpretation of the term “free-stream.”

Note: The Airflow Cooling Estimate method is an estimate. Use it solely when an approximate value

suffices. Accuracy can only be assured using the Case Temperature measuring method or the

Heatsink Temperature measuring method. Apply these methods to insure a reliable performance.

"Heatsink-to-Air Thermal Resistance," speciﬁes the thermal resistance of the heatsink as a function of the air

velocity.

Heatsink-to-Air Thermal Resistance

Air Velocity

(ft/min)^[1]

150

200

300

400

500

650

800

1000

_SA(°C/W)^[2]

1.21

1.05

0.91

0.84

0.78

0.72

0.67

0.64

1. Ducted airﬂow through the heatsinks.

2. Airﬂow direction parallel to the shorter axis of the pin-ﬁn heatsink (1.9"L x 3.6"W x 1.1"H)

Air Velocity Speciﬁcations

These speciﬁcations are recommended for a typical conﬁguration:

Airflow Topside

150 LFM @ 30 °C up to 2,000 feet, altitude, maximum

300 LFM @ 40 °C up to 10,000 feet, altitude, maximum

Airflow Bottomside

100 LFM @ 30 °C up to 2,000 feet, altitude, maximum

150 LFM @ 40 °C up to 10,000 feet, altitude, maximum

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

Case Temperature Measuring Method

The relationship between case temperature and junction temperature is described in the following thermal

equation.

If Tc is known, then Tj can be calculated:

Tj = Tc + (Pd x θjc)

Note: Testing is done with the worst-case power draw, software loading, and ambient air temperature.

There is good tracking between the case temperature and the heatsink temperature.

Heatsink Temperature Measuring Method

Measuring the heatsink temperature is sometimes easier than measuring the case temperature. This method

provides accurate results for most designs. If the heatsink temperature (Ts) is known then the following ther-

mal equation can be used to estimate the junction temperature:

Tj = Ts + [Pd (θjc + θcs)]

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

JTAG TESTABILITY

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, (SME5224AUPA-400), implements the IEEE 1149.1

standard to aid in board level testing. Boundary Scan Description Language (BSDL) ﬁles are available for all

the active devices on the module, except the clock buffer.

AC Characteristics - JTAG Timing

400 MHz CPU

10 MHz TCK

Symbol

t_W(TRST)

t_SU(TDI)

t_SU(TMS)

t_H(TDI)

Parameter

Signals

TRST^[1]

TDI

Conditions

Min Typ

Max

–

Units

Test reset pulse width

Input setup time to TCK

Input hold time to TCK

Output delay from TCK^[2]

–

TMS

–

TDI

1.5

–

t_H(TMS)

t_PD(TDO)

t_OH(TDO)

TMS

–

TDO

I_OL= 8 mA

–

Output hold time from TCK ^[2]TDO

–

_OH= -4 mA

C_L= 35 pF

_LOAD= 1.5V

1. TRST is an asynchronous reset.

2. TDO is referenced from falling edge of TCK.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

JTAG (IEEE 1149.1) TIMING

V_IH

Clock

2.0V

V_IL

V_IH

V_IL

t_SU

t_H

Data Input

1.5V

Figure 10. Voltage Waveforms - Setup and Hold Times

V_IH

Clock

2.0V

t_PD

V_IL

t_OH

V_OH

V_OL

V_OH

V_OL

In-Phase

Output

2.0V

0.8V

t_PD

t_OH

Out-of-Phase

Output

0.8V

Figure 11. Voltage Waveforms - Propagation Delay Times

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

UPA CONNECTOR PIN ASSIGNMENTS (TOP VIEW)

Pin 1

(Pin 1) UPA_ADDR[0]

GND (Pin 2)

VDD (Pin 8)

GND

(Pin 4) UPA_ADDR[1]

(Pin 10) UPA_ADDR[3]

UPA_ADDR[5]

GND (Pin 5)

GND (Pin 11)

GND

(Pin 7) UPA_ADDR[2]

UPA_ADDR[4]

UPA_ADDR[6]

VDD_CORE

GND

UPA_ADDR[7]

GND

UPA_ADDR[16]

UPA_ADDR[18]

UPA_ADDR[20]

UPA_ADDR[22]

UPA_ADDR[32]

UPA_ADDR[34]

UPA_REQ_IN[2]

UPA_P_REPLY[1]

UPA_XIR_L

UPA_ADDR[17]

UPA_ADDR[19]

UPA_ADDR[21]

UPA_ADDR[23]

UPA_ADDR[33]

UPA_RATIO

VDD_CORE

GND

VDD_CORE

GND

VDD_CORE

GND

VDD_CORE

GND

UPA_P_REPLY[0]

UPA_P_REPLY[2]

UPA_CLK0_POS

TDI

GND

VDD_CORE

GND

UPA_CLK0_NEG

TEMP_SENSE_POS

UPA_PORT_ID[0]

UPA_S_REPLY[1]

UPA_SPEED[0]

UPA_ECC[10]

GND

VDD_CORE

UPA_PORT_ID[1]

GND

POWER_0V

VDD_CORE

GND

TEMP_SENSE_NEG

UPA_S_REPLY[0]

UPA_S_REPLY[2]

UPA_ECC[11]

GND

VDD_CORE

GND

UPA_ECC[9]

VDD_CORE

GND

UPA_ECC[8]

GND

UPA_DATA[87]

UPA_DATA[86]

GND

UPA_DATA[85]

VDD_CORE

GND

UPA_DATA[84]

GND

UPA_DATA[83]

(Pin 133) UPA_DATA[82]

(Pin 139) UPA_DATA[80]

VDD_CORE (Pin 134)

GND (Pin 140)

(Pin 136) UPA_DATA[81]

(Pin 142) UPA_DATA[71]

GND (Pin 137)

GND (Pin 143)

(Pin 145) UPA_DATA[70]

(Pin 151) UPA_DATA[68]

UPA_DATA[66]

UPA_DATA[64]

UPA_DATA[118]

UPA_DATA[116]

UPA_DATA[114]

UPA_DATA[112]

UPA_DATA[102]

UPA_DATA[100]

UPA_DATA[98]

UPA_DATA[96]

UPA_ECC[2]

VDD_CORE (Pin 146)

GND (Pin 152)

GND

(Pin 148) UPA_DATA[69]

(Pin 154) UPA_DATA[67]

UPA_DATA[65]

UPA_DATA[119]

UPA_DATA[117]

UPA_DATA[115]

UPA_DATA[113]

UPA_DATA[103]

UPA_DATA[101]

UPA_DATA[99]

UPA_DATA[97]

UPA_ECC[3]

GND (Pin 149)

VDD_CORE (Pin 155)

GND

VDD_CORE

GND

VDD_CORE

GND

VDD

GND

VDD

GND

VDD

GND

VDD

UPA_ECC[1]

GND

UPA_ECC[0]

GND

UPA_DATA[55]

UPA_DATA[53]

UPA_DATA[51]

UPA_DATA[49]

UPA_DATA[39]

UPA_DATA[37]

UPA_DATA[35]

UPA_DATA[33]

UPA_DATA[23]

UPA_DATA[21]

UPA_DATA[19]

UPA_DATA[17]

UPA_DATA[7]

GND

UPA_DATA[54]

UPA_DATA[52]

UPA_DATA[50]

UPA_DATA[48]

UPA_DATA[38]

UPA_DATA[36]

UPA_DATA[34]

UPA_DATA[32]

UPA_DATA[22]

UPA_DATA[20]

UPA_DATA[18]

UPA_DATA[16]

UPA_DATA[6]

VDD

GND

VDD

GND

VDD

GND

VDD

GND

VDD

GND

VDD

GND

VDD

GND

VDD

UPA_DATA[5]

GND

UPA_DATA[4]

GND

UPA_DATA[3]

GND

UPA_DATA[2]

VDD

UPA_DATA[1]

GND

(Pin 319) UPA_DATA[0]

(Pin 325) CPU_CLK_POS

GND (Pin 320)

GND (Pin 326)

(Pin 322) UPA_ECC_VALID

(Pin 328) CPU_CLK_NEG

VDD (Pin 323)

GND (Pin 329)

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

UPA CONNECTOR PIN ASSIGNMENTS (BOTTOM VIEW)

Pin 3

(Pin 2) GND

UPA_ADDR[8] (Pin 3)

UPA_ADDR[10] (Pin 9)

UPA_ADDR[12]

UPA_ADDR[14]

UPA_ADDR[24]

UPA_ADDR[26]

UPA_ADDR[28]

UPA_ADDR[30]

UPA_ADDR[35]

UPA_REQ_OUT

UPA_REQ_IN[1]

UPA_P_REPLY[4]

UPA_DATA_STALL

TRST_L

UPA_ADDR[9] (Pin 6)

(Pin 5) GND

(Pin 11) GND

GND

(Pin 8) VDD

GND

UPA_ADDR[11] (Pin 12)

UPA_ADDR[13]

UPA_ADDR[15]

UPA_ADDR[25]

UPA_ADDR[27]

UPA_ADDR[29]

UPA_ADDR[31]

UPA_ADDR_VALID

UPA_REQ_IN[0]

UPA_P_REPLY[3]

UPA_SC_REQ_IN

TCK

VDD_CORE

GND

VDD_CORE

GND

VDD_CORE

GND

VDD_CORE

GND

VDD_CORE

GND

VDD_CORE

GND

POWER_SET_POS

TMS

VDD_CORE

UPA_PORT_ID[1]

GND

POWER_SET_NEG

UPA_RESET_L

UPA_S_REPLY[4]

UPA_SPEED[1]

UPA_ECC[14]

POWER_0V

VDD_CORE

GND

UPA_S_REPLY[3]

UPA_SPEED[2]

UPA_ECC[15]

GND

VDD_CORE

GND

UPA_ECC[13]

VDD_CORE

GND

UPA_ECC[12]

GND

UPA_DATA[95]

UPA_DATA[94]

GND

UPA_DATA[93]

VDD_CORE

GND

UPA_DATA[92]

GND

UPA_DATA[91]

UPA_DATA[90] (Pin 135)

UPA_DATA[88] (Pin 141)

(Pin 134) VDD_CORE

(Pin 140) GND

UPA_DATA[89] (Pin 138)

UPA_DATA[79] (Pin 144)

(Pin 137) GND

(Pin 143) GND

UPA_DATA[78] (Pin 147)

UPA_DATA[76] (Pin 153)

UPA_DATA[74]

(Pin 146) VDD_CORE

(Pin 152) GND

GND

UPA_DATA[77] (Pin 150)

UPA_DATA[75] (Pin 156)

UPA_DATA[73]

UPA_DATA[127]

UPA_DATA[125]

UPA_DATA[123]

UPA_DATA[121]

UPA_DATA[111]

UPA_DATA[109]

UPA_DATA[107]

UPA_DATA[105]

UPA_ECC[7]

(Pin 149) GND

(Pin 155) VDD_CORE

GND

UPA_DATA[72]

GND

VDD_CORE

GND

UPA_DATA[126]

UPA_DATA[124]

UPA_DATA[122]

UPA_DATA[120]

UPA_DATA[110]

UPA_DATA[108]

UPA_DATA[106]

UPA_DATA[104]

UPA_ECC[6]

GND

VDD_CORE

GND

VDD

GND

VDD

GND

VDD

GND

VDD

UPA_ECC[5]

GND

UPA_ECC[4]

GND

UPA_DATA[63]

UPA_DATA[61]

UPA_DATA[59]

UPA_DATA[57]

UPA_DATA[47]

UPA_DATA[45]

UPA_DATA[43]

UPA_DATA[41]

UPA_DATA[31]

UPA_DATA[29]

UPA_DATA[27]

UPA_DATA[25]

UPA_DATA[15]

UPA_DATA[13]

UPA_DATA[11]

UPA_DATA[9]

GND

UPA_DATA[62]

VDD

GND

UPA_DATA[60]

GND

VDD

UPA_DATA[58]

GND

UPA_DATA[56]

GND

VDD

UPA_DATA[46]

GND

UPA_DATA[44]

VDD

GND

UPA_DATA[42]

GND

UPA_DATA[40]

VDD

GND

UPA_DATA[30]

GND

VDD

UPA_DATA[28]

GND

UPA_DATA[26]

GND

VDD

UPA_DATA[24]

GND

UPA_DATA[14]

VDD

GND

UPA_DATA[12]

GND

UPA_DATA[10]

VDD

GND

UPA_DATA[8] (Pin 321)

UPA_CLK1_POS (Pin 327)

(Pin 320) GND

(Pin 326) GND

TDO (Pin 324)

(Pin 323) VDD

(Pin 329) GND

UPA_CLK1_NEG (Pin 330)

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

STORAGE AND SHIPPING SPECIFICATION

Value

Parameter

Temperature

Conditions

Min.

-40

–

Typ.

Max

Unit

°C

Ambient

–

Temperature ramp

°C/min.

inches

Shock (shipping)

Drop height on to any edge, corner, or side of

shipping box

–

- single module package

Shock(shipping)

Drop height on to any edge, corner, or side of

shipping box

–

inches

- multi-module package

HANDLING CPU MODULES

CAUTION: Handle a module by carefully holding it by its edges and by the large CPU heatsink. Do not

bump or handle the SRAM heatsinks because this action can cause unseen damage to the solder connections.

Always handle modules and other electronic devices in an ESD-controlled environment.

July 1999

Sun Microsystems, Inc

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

Advanced Version

SME5224AUPA-400

ORDERING INFORMATION ^[1]

Part Number

CPU Speeds

Description

SME5224AUPA-400

400 MHz CPU

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, features the UltraSPARC-II

CPU at 400 MHz, a 4.0 Mbyte external cache, and two UDB-II data buffer ASICs.

1. To order the data sheet for this device use the document part number: 805-6390-05

DOCUMENT REVISION HISTORY

Date

July 1999

Document No.

Change

805-4835-05

This module is designed using the the UltraSPARC™–II, 400 MHz CPU,

revision 3.x. See page 9, "Module Clocks," for changes effecting this version of

the module.

May 1999

805-6390-04

Re-organization of the datasheet and update of speciﬁcations.

March 1999

805-6390-03

New section concerning the System Timing and Thermal Speciﬁcations.

Revised speciﬁcations for DC characteristics and module power consumption.

Preliminary Version

December 1998

805-6390-02

Illustrations reﬂect a new heat sink design. Thermal section reﬂects the latest

heatsink design.

Advanced Version

July 1999

Sun Microsystems, Inc

SME5224AUPA-400

Sun Microsystems, Inc.

901 San Antonio Road

Palo Alto, CA 94303-4900 USA

800/ 681-8845

www.sun.com/ microelectronics

THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED “AS IS” WITHOUT ANY EXPRESS REPRESENTATIONS OF WARRANTIES. IN

ADDITION, SUN MICROSYSTEMS, INC. DISCLAIMS ALL IMPLIED REPRESENTATIONS AND WARRANTIES, INCLUDING ANY WARRANTY OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTURAL PROPERTY RIGHTS.

This document contains proprietary information of Sun Microsystems, Inc. or under license from third parties. No part of this document may be reproduced

in any form or by any means or transferred to any third party without the prior written consent of Sun Microsystems, Inc.

Sun, Sun Microsystems, the Sun Logo, Ultra, and VIS are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other

countries. All SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and

other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc.

The information contained in this document is not designed or intended for use in on-line control of aircraft, aircraft navigation or aircraft communications;

or in the design, construction, operation or maintenance of any nuclear facility. Sun disclaims any express or implied warranty of fitness for such uses.

Part Number: 805-6390-05

SME5224AUPA-400

July 1999

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

DATASHEET

MODULE DESCRIPTION

The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, (SME5224AUPA-400) delivers high performance

computing in a compact design. Based on the UltraSPARC™-II CPU, this module is designed using a small

form factor board with an integrated external cache. It connects to the high bandwidth Ultra™ Port Architec-

ture UPA bus via a high speed sturdy connector. The UltraSPARC™–II, 400 MHz CPU, 4.0 Mbyte module, can

plug into any UPA connector, saving system design costs and reducing the production time for new systems.

Heatsinks are attached to components on the module board. The module board is encased in a plastic shroud.

The purpose of this shroud is to protect the components and channel airﬂow. Module design is geared

towards ease of upgrade and ﬁeld support.

Module Features

Module Beneﬁts

Ease of System Design

•

Small form factor board with integrated external cache

and UPA interface

•

JTAG boundary scan and performance instrumentation

PCB provides a multi-power plane bypass, reducing

systemboard design requirements

Performance

•

High performance UltraSPARC™ CPU at 400MHz

Four megabytes of external cache using high speed

•

Dedicated high bandwidth bus to processor

Glueless MP Support

Implements the high performance AUPA interface

Supports up to 16 Mbyte of external cache in a

four-way MP system

Simplify System Qualiﬁcations by

Complying with Industry and Government

Standards

•

Backwards compatibility with systems implementing a

UPA interface

Plastic shroud protects components and channels

airﬂow

•

Multi-layer PCB controls EMI radiation

Edge connectors and ejectors

Small form factor board encased in a heat resistant

shroud

•

On-board voltage regulator accepts 2.6 volts for the

Vdd_core; compatible with existing systems

UltraSPARC^™-II CPU Module

400 MHz CPU, 4.0 MB E-Cache

SME5224AUPA-400

CPU DESCRIPTION

UltraSPARC-II CPU

The UltraSPARC™-II CPU is the second generation in the UltraSPARC™ s-series microprocessor family.

A complete implementation of the SPARC V9 architecture, it has binary compatibility with all previous ver-

sions of the SPARC™ microprocessor family.

The UltraSPARC™-II CPU is designed as a cost effective, scalable and reliable solution for high-end worksta-

tions and servers. Meeting the demands of mission critical enterprise computing, theUltraSPARC™-II CPU

runs enterprise applications requiring high data throughput. It is characterized by a high integer and ﬂoating

point performance: optimally accelerating application performance, especially multimedia applications.

Delivering high memory bandwidth, media processing and raw compute performance, the UltraSPARC™-II

CPU incorporates innovative technologies which lower the cost of ownership.

CPU Features

CPU Beneﬁts

•

64-bit SPARC-V9 architecture increases the

Architecture

network computing application’s performance

•Thirty-two 64-bit integer registers

Allows applications to store data locally in the

•Superscalar/Superpipelined

Allows for multiple integer and ﬂoating point

execution units leading to higher application

performance

•High performance memory interconnect

•Built-in Multiprocessing Capability

•

Alleviating the bottleneck of bandwidth to main

memory

Delivering scalability at the system level, thus

increasing the end user’s return on investment

•VIS multimedia accelerating instructions

Reducing the system cost by eliminating the

special purpose media processor

•100% binary compatibility with previous versions

of SPARC™

Increasing the return on investment of software

applications

•Uses 0.25 micron technology and packaging

Enhanced processor performance with decreased

power consumption, thus increasing the reliability

of the microprocessor

Performance

•Integer

•

17.4(SPECint95)

•Floating Point

25.7 (SPECfp95)

•Bandwidth (BW) to main memory

1.6 Gbyte/sec (peak) with a 100MHz UPA

Unique Features

•Block load and store instructions

•

Delivering high performance access to large

datasets across the network

•JTAG Boundary Scan and Performance

Instrumentation

Enabling UltraSPARC™ based systems to offer

features such as: power management, automatic

error correction, and lower maintenance cost